Analysis of Camera IC Thermal Design

With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller. At the same time, the computing speed is getting faster and faster, and the heat generation is also getting larger and larger. For example, the heat generated by the Intel processor 3.6G Pentium 4 Ultimate Edition runs at its maximum. Up to 115W, this puts higher requirements on the heat dissipation of the chip.

Designers must use advanced heat-dissipating technology and excellent heat-dissipating materials to effectively take away heat and ensure that the chip can work normally within the maximum temperature that can be tolerated by the chip. The appearance of electronic devices and terminals is increasingly demanding thin and small development. Televisions have evolved from CRTs to LCD flat panel TVs, desktop computers to notebook computers, digital set-top boxes, portable CDs, etc. The design of heat dissipation is different from that of traditional forms. The product is relatively thin. Statistics show that for every 2 degree increase in temperature of electronic components, the reliability is reduced by 10%; the lifetime at a temperature rise of 50 degrees is only 1/6 of the temperature rise of 25 degrees. Temperature is the most important factor affecting equipment reliability. This requires technical measures to limit the temperature rise of the chassis and components. This is thermal design.

The principle of thermal design is to reduce the amount of heat, that is, to select better control methods and technologies, such as phase shift control technology and synchronous rectification technology. In addition, low-power devices are used to reduce the number of heat-generating devices. The width of the rough printed lines increases the efficiency of the power supply. The second is to enhance heat dissipation, which uses heat transfer, radiation, and convection to transfer heat. However, for products with a flat appearance, first of all, from the standpoint of space, it is not possible to use more heat-dissipating aluminum sheets and fans. Overall, it is not allowed to strengthen Cold cooling design, can not use the form of convection. Radiating heat is also difficult to achieve in a flat space. Therefore, we all thought that the use of chassis heat dissipation, the benefit is not to consider fan plus fan power supply, will not cause more dust due to the fan, there is no noise caused by the fan. How can we really use the heat of the machine shell?

The opportunity for the application of flexible silicone thermal insulation material comes. Soft thermal insulation silicone insulation pad is a kind of heat transfer interface material, is a sheet material, can be arbitrarily cut according to the size and shape of the heating power device, has good thermal conductivity and insulation properties, its role is to fill the heat power device The gap between the heat sink and the heat sink is the best product to replace the binary heat dissipation system of the thermal grease and the mica sheet (insulating material).

The product's thermal conductivity is 3.6W/mK, while the air's thermal conductivity is 0.023w/mk; the voltage breakdown value is above 4000V, and it can be used in most electronic devices. The process thickness is from 0.5mm. ~5mm, ranging from 0.5mm1mm1.5mm2mm up to 5mm, special requirements can be increased to 10mm. The difference in thickness is to allow the designer to easily select the position of the PCB and the heat-generating device. It meets the requirements of U.L94V-0 and meets EU SGS environmental protection certification. The working temperature is generally -50°C~220°C. Therefore, it is a very good thermal conductive material. It is also particularly soft and specially designed for the use of gaps to transfer heat. It can fill the gap, complete the heat transfer of the heating part and the heat dissipation part, increase the heat transfer area, and also play the role of damping insulation seal, etc., can meet the design requirements of the miniaturization and ultra-thinning of the social equipment, and it is extremely craft and use. Sexual new materials. With a wide range of thicknesses, it is particularly suitable for automotive, display, computer and power electronics. Heat dissipation is as simple as one!

Actmix®Polymer-bound Pre-dispersed Rubber Chemicals and addivitives

Polymer-bound pre-dispersed rubber chemicals and additives are generally used for the automotive sealing strips, rubber hose, conveyor belt, damping, sealing etc rubber technical parts, and rubber tyres; which has mixed with the EPDM, SBR, NBR, ACM, ECO or IR. These kind of Pre-dispersed Rubber Additives are more and more popular because of the excellent dispersion and dust-free than powder form rubber chemicals.


Advantage of Actmix®Polymer-bound pre-dispersed rubber chemicals and additives:

·  1. Excellent dispersibility in the rubber compound.

·  2. Dust less & Non moisture absorption.

·  3. Saving mixing time.

·  4. Stable physical properties.

·  5. Convenient to auto measuring procedures.

·  6. Safer and healthier to operators.


  Actmix®Pre-dispersed rubber chemicals and additives masterbatch product range:

·  1. Thiazole, Thiuram, Dithiocarbamate, Guandine and Thiourea accelerators.

·  2. Vulcanizing agent

·  3. Anti-oxidant and Scorching retarders

·  4. Blowing Agent and promoter

·  6. Non-Nitrosaminee Accelerator. ZDTP-50, TP-50, Retarder E-80,TBzTD-70 etc.

Actmix Pre Dispersed Rubber Chemicals And Additives

Pre-dispersed Rubber Additives

Pre-dispersed Rubber Additives,Pre-dispersed Masterbatch Rubber Additive,Pre-Dispersed Polymer Bound rubber,Pre-dispersed Rubber Accelerator

Ningbo Actmix Rubber Chemicals Co., Ltd. ,