Abstract Researchers at the Dutch Academy of Nanosciences have grown diamond films on quartz substrates and then separated them to place the resulting diamond films on other devices. It has opened the way for the wide application of nano-diamond films. Material scientist said that we can pass a simple...
Researchers at the Dutch Academy of Nanosciences have grown diamond films on quartz substrates and then separated them to place the resulting diamond film on other devices. It has opened the way for the wide application of nano-diamond films. Materials scientists say that we can obtain and process diamond nanofilms in a simple way and then place them on a wide variety of equipment to test this extraordinary material on a variety of equipment.
Diamond film is one of the most extraordinary materials on earth. Not only high strength, high transparency, but also good thermal conductivity. Although they are biologically inert, we can attach molecules to their surface to make their chemical properties active. More importantly, when they are doped with additives, they become semiconductors and can be applied to electronic circuits.
It's no wonder that materials scientists are looking forward to the future of diamonds, and they want to apply diamonds more or less to all the devices they can think of.
The problem is that the diamond film must be grown in a high temperature pure hydrogen atmosphere, which is not compatible with other micro devices such as silicon chip fabrication methods.
So a useful way is to find ways to grow the diamond film in one place and then transfer it to another place so that the diamond film can be placed on a chip or other device.
Today, Venkatesh Seshan of the Netherlands Academy of Nanosciences and several companions say they have improved a method of growing diamond films on quartz substrates, then separating them, and finally placing the resulting diamond film on other devices.
The team first placed the nanodiamond seed crystal on the quartz surface and heated it to more than 500 C in a hydrogen plasma atmosphere. The seed crystal then grows to give a 180 nm thick, transparent diamond crystal surface.
The team refined a new technology for separating diamond films from substrates. During the growth of the diamond film, these materials expand at different rates to create stress that separates one layer of material from the other. “By choosing the right conditions, the stress is enough to cause the 180 nm thick diamond film to fall off the quartz surface, forming numerous sheets,†Seshan and his partner said.
The team used an optical microscope to identify the diamond flakes and then peeled them off with a layer of adhesive film, just like a piece of graphite tape with clear tape. The adhesive film is positioned on a device such as an electronic circuit and then pressed into place. The adhesive film is slowly peeled off from the diamond nanosheets, which takes 10 minutes.
Seshan and his partners test their technology by producing a large number of diamond thin film devices. These devices include drum resonators, electronic circuits, and even placing diamond pieces on top of other sheets of material to prove that it is quite possible to create entirely new materials with alternating layers of material.
The new technology allows the team to easily characterize nanodiamond films in a range of new situations. It also opens the way for the widespread use of nano-diamond films in other areas.
Of course, there is one point to declare in advance. Identifying and locating nanosheets is a time consuming process. Therefore, this technology cannot be applied to equipment for mass production of diamond flakes. Therefore, there is still a long way to go in large-scale automatic positioning and parallelization technology.
But with the rapid development of machine vision technology, it may break this limitation in the near future. It is only the large-scale parallelization of this manufacturing technology that requires more research.
The potential of this technology is obvious, it can bring a new technology to complement the silicon era and graphene era we are currently experiencing. In other words, we can start to look forward to the arrival of the "diamond" era.
CuW alloys are used where the combination of high heat resistance, high electrical and thermal conductivity, and low thermal expansion are needed. Some of the applications are in electric resistance welding, as electrical contacts, and as heat sinks. As contact material the alloy is resistant to erosion by electric arc. WCu alloys are also used in electrodes for electrical discharge machining and electrochemical machining.
Copper–tungsten (tungsten–copper, CuW, or WCu) alloy is a pseudo-alloy of copper and tungsten. As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The microstructure is therefore rather a metal matrix composite instead of a true alloy.
Copper Tungsten Alloy Electrode
Powder Metallurgy Process,Cuw Alloy Contact,Copper Tungsten Alloy Electrode,Copper Tungsten Electrodes
Shenyang New Industry Co.,LTD , https://www.topcobalt.com