Cracking is a great hidden danger in solar cells, and it can't be repaired by cracks. It will eventually become debris and cause damage, even threatening other qualified silicon wafers. At present, there is no mature technology for the detection of silicon cracks in the industry. With the rapid development of the solar photovoltaic industry in recent years, solar energy has become the third largest renewable energy source after water and wind energy. Because of its green, environmental protection, cleanliness and sustainable development, many companies have entered the solar photovoltaic industry. The new energy industry has accelerated its adjustment, and corporate mergers and acquisitions have intensified, most of which are solar panel manufacturers. How to seek development in the competition, in terms of enterprises, it is necessary to continuously improve the level of production technology, and it is particularly important to produce high-quality solar photovoltaic products. Cracking is a great hidden danger in solar cells, and it can't be repaired by cracks. It will eventually become debris and cause damage, even threatening other qualified silicon wafers. At present, there is no mature technology for the detection of silicon cracks in the industry. Through the repeated experiment of infrared light detection in silicon wafers, Machine Vision's new technology detects and sorts solar cells and silicon wafers by detecting the total reflection of infrared rays on silicon molecules and adding prisms for focusing. I. Formation and Harm of Silicon Cracks Crystalline crystals are chemically stable at room temperature. Once they reach high temperature, they become active and are an important semiconductor material and the main raw material for the production of solar cells. However, the crystalline silicon texture is very brittle and brittle. The production process of solar cells is complicated, and the thickness of silicon wafers used in current solar cells is usually around 180 um, which is very thin. In complex production processes and mutual transfer between processes, the contact collision process is extremely fragile and cracked. The debris is clearly visible to the naked eye and can be selected in time to not flow into the next process resulting in greater waste. However, if it is a crack, it is difficult to distinguish by the naked eye. Once it flows into the next process for production, the waste is even greater. Even cracked silicon wafers can easily become fragments when they are bumped in production and transport, and the presence of debris can pose a threat to other qualified silicon wafers, either by flakes or adhering to other silicon wafers. The battery that is ultimately produced in that case is a waste product. If the debris enters the wafer cassette, then the two pieces of the cell next to the chip will be affected. It can be seen that the cracked silicon wafer is quite harmful. In the end, it may lead to a large amount of waste of labor, machinery and equipment, and the risk of product quality risks. Therefore, the earlier the discovery of the hidden silicon wafer raw materials, the less waste, the lower the cost of battery production, the more competitive the enterprise. Second, the characteristics of infrared and silicon chip crack detection principle Infrared is a wavelength range of 0.78-100um electromagnetic waves, not seen by the human eye, its most important physical characteristics is strong thermal effect, strong penetration, because This special feature of infrared makes it extremely versatile. It can be used in security surveillance, automotive night vision systems, medical device industry, home electronics industry, communication field, and the technology in various fields is quite mature, even in the emerging 3D. Infrared technology also has a place in technology. The use of infrared is so extensive. According to the theory, infrared rays can still be used in the detection technology for cracking silicon wafers in the solar photovoltaic industry. The fiber in the wafer inspection technology in the silicon wafer industry cannot be absorbed by silicon materials and cannot penetrate silicon materials. This technology utilizes the total reflection of infrared light on silicon molecules. The technology utilizes the characteristic of infrared light, and the light source that penetrates the critical wavelength of the silicon wafer irradiates the silicon wafer, and the silicon wafer is injected parallel from the side of the silicon wafer, which is caused by the special crystal bond structure of the silicon material. The fiber is totally reflected between each complete crystal bond, and on the surface it is absorbed by the silicon wafer. However, if there is a crack on the silicon wafer, then the crystal bond at this position is broken, and the fiber will be transmitted from the position where the crystal bond is broken and captured by the upper camera. The alarm will alarm and the device will stop automatically. Third, the application of infrared detection in the detection of silicon chip crack detection Currently there is no other mature technology in the detection of silicon chip crack detection. The application of infrared detection technology in the detection of crack detection provides a very difficult solution to the long-term problem of solar photovoltaic enterprises. A good solution. The whole set of technology uses infrared emitting device to emit laser. The transmitting device is installed on the side of the transmission silicon device. Because the production equipment of each part of the solar cell is continuous to the silicon wafer, each side needs an infrared emitting device. To achieve comprehensive and accurate testing, there will be no missed inspections. A prism is mounted behind the launcher to focus the emitted beam. The focused infrared rays are taken in parallel to the side of the silicon wafer to achieve detection of the break. A device with this function can be installed in each process, and the crack detection of the silicon wafer is started from the first process, which greatly reduces the waste of materials. Since the silicon wafer for producing solar cells is extremely thin, only 180um, and the light is incident from the thinnest side of the silicon wafer, the alignment requirements of the infrared emitting device, the focusing prism, and the silicon wafer are extremely high, and the difference is several micrometers. Will not achieve the effect of detection. The machine vision infrared crack detection realizes the problem that the silicon wafer inspection system can not detect the crack, and also provides a solution for the solar cell sorter to detect the crack. The application of infrared crack detection will certainly provide power for the development of sorting detection technology in the entire photovoltaic industry, thus breaking the blank of silicon chip crack detection technology.
Silicon chip crack detection effect http://news.chinawj.com.cn Editor: (Hardware Business Network Information Center) http://news.chinawj.com.cn
Pharmaceutical intermediates are actually some chemical materials or products used in the process of drug synthesis. This kind of chemical product do not need the production license of the medicine, which can be produced in the ordinary chemical plant. As long as it reach some level, it can be used for the synthesis of the medicine.
The so-called pharmaceutical intermediates are actually some chemical raw materials or chemical products used in the process of pharmaceutical synthesis. This chemical product, which does not require a production license of a drug, can be produced in a common chemical plant and can be used for the synthesis of drugs as long as it reaches some level.
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